PVD 1

  • Thermal: 2 sources available, currently not occupied.
  • E-beam: Ni, Cr, Al, Ti
  • RF Sputter: Al2O3
  • DC Sputter: Ni, Al, Al/Si, Cr, Ti
  • Sources: 2 thermal, 4 e-beam, 2 DC sputter (1 source for ferromagnetic materials), 2 RF sputter
  • 5E-7 Torr base pressure
  • Processing for small pieces, 50 and 100 mm wafers

Tool Specs

Tool Status Up
Manufacturer Bestec
Typical Application Metal deposition
Location 6060.8
Related Documents

Standard Operating Procedure

Training Contact Chris Balicki - balicki@4dlabs.ca