Wafer bonder

The AML-AWB aligner wafer bonder platform can perform in-situ aligned bonding of two flat substrates using the following bonding methods: anodic, glass frit, adhesive, thermo-compression, eutectic, solder and direct (low T “RAD” activated)

  • In-situ visible and IR alignment with 1 micron accuracy
  • Ultimate vacuum: 5 x 10-6 mbar
  • Application of high voltages up to 2.5 kV
  • Max 560°C for tungsten upper and lower platens, max 450°C for graphite upper platen (for glass bonding)
  • Wafer size: 4" and 6"
  • Forced nitrogen cooling optionWedge-wedge and ball-wedge bonding on the same machine

Tool Specs

Manufacturer AML
Model AWB04
Location 6060.13
Related Documents Standard Operating Procedure
Training Contact Mohamad Rezaei - rezaei@4dlabs.ca